Overcoming society's greatest challenges requires mastery of how information is created, moved, and used.

Headquartered in Carlsbad, CA, Polaris Electro-Optics is building the future of optical interconnects to power the next wave of AI and data center architecture.

At the core of our vision is FenGlass™ — a groundbreaking ferroelectric nematic glass modulator platform that redefines what's possible in integrated photonics. By delivering a true field-driven Pockels effect, FenGlass™ breaks through the bandwidth, power, and loss limitations of traditional silicon photonics. It achieves ultra-high-speed modulation of 400 Gbps per lane and beyond with sub-volt drive voltages, packed into the smallest footprint on the market today.

We engineer performance for real-world scale. Integrated post-foundry without high-voltage poling or exotic wafer bonding, Polaris seamlessly leverages standard silicon photonics PDKs and established 300mm foundry infrastructure. With demonstrated Telcordia reliability and multi-pass solder reflow compatibility, our platform delivers full CMOS backend compatibility paired with the true scalability of silicon photonics.

Polaris addresses all AI interconnect applications: from coherent scale-across and scale-out pluggable modules to near-packaged (NPO) and co-packaged optics (CPO). By collaborating directly with module makers, hyperscalers, DSP and switch manufacturers, and system integrators, we are accelerating deployment, reducing risk, and driving toward our first commercial product launch in 2027.